We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Love Cleaning Machine.
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Love Cleaning Machine Product List and Ranking from 6 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Aug 27, 2025~Sep 23, 2025
This ranking is based on the number of page views on our site.

Love Cleaning Machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Aug 27, 2025~Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. ゼビオス(XEVIOS CORP.,) Saitama//Industrial Machinery
  2. テクニカルフィット Saitama//Industrial Machinery
  3. スピードファムクリーンシステム Kanagawa//Industrial Machinery
  4. 4 アイディー技研 Saitama//Manufacturing and processing contract
  5. 5 ヴァリアス Shizuoka//Industrial Machinery

Love Cleaning Machine Product ranking

Last Updated: Aggregation Period:Aug 27, 2025~Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc. 2 to 6 inches) ゼビオス(XEVIOS CORP.,)
  2. Single Chamber Type "Wafer Multi-Purpose Spin Scrub Cleaning Device" ゼビオス(XEVIOS CORP.,)
  3. Dual-Sided Simultaneous Scrub Cleaning Device (Ultrasound Combined) DSS-320 スピードファムクリーンシステム
  4. Scrubber cleaning device アイディー技研
  5. 4 Scrub Cleaning Device After CMP Processing for Semiconductors ヴァリアス

Love Cleaning Machine Product List

1~12 item / All 12 items

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Small item substrate compatible "Dual-side simultaneous scrub cleaning device"

Small item substrate compatible "Dual-side simultaneous scrub cleaning device"

Compatible with small substrates! Double-sided scrub cleaning device ■□■ Features ■□■ ■ No restrictions on the shape of the workpiece ■ Easy double-sided scrubbing just by placing it ■ Can be operated while sitting ■ Equipped with a convenient work storage tank ■ Transparent table for easy maintenance ■ No setup changes needed for thicknesses from 0.05 to 1mm ■ Equipped with a soft yet powerful 20μ ultra-fine brush ■ Compact size similar to an office desk ■ Easy to move with casters ■ Ultrasonic feature under the scrub Achieves powerful combination cleaning with brushing and ultrasonic ■ For other functions and details, please download the catalog or contact us.

  • Other cleaning machines
  • Ultrasonic Oscillator

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Dual-Sided Simultaneous Scrub Cleaning Device (Ultrasound Combined) DSS-320

Dual-Sided Simultaneous Scrub Cleaning Device (Ultrasonic Combined) DSS-320

High-density special brush adopted! Simultaneous double-sided! Ultrasonic combined scrubber ■□■ Features ■□■ ■ Prevents accumulation of contamination on the brush by scrubbing in water ■ Immersion scrub method that prevents reattachment of dirt to the substrate ■ No need to change setup for sizes from 0.1mm to 1mm ■ Double cleaning with scrub + ultrasonic ■ Cassette-to-cassette method adopted ■ Applicable workpieces: Φ3” to 6”Φ, 0.1mm to 1mm square, round ■ For other functions and details, please download the catalog or contact us.

  • Other cleaning machines
  • Ultrasonic Oscillator

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Single Chamber Type "Wafer Multi-Purpose Spin Scrub Cleaning Device"

A space-saving cleaning device that removes foreign substances and metal contamination in a single chamber! It accommodates applications from mass production to research and development through a combination of cleaning methods.

A single-wafer device that performs the processes of surfactant and pure water scrub cleaning, chemical spraying, megasonic spot shower, and spin drying all in one chamber. ◇ Space-saving design that completes the process in a single chamber ◇ Compatible with various wafers including Si (silicon), LT (lithium tantalate), and SiC (silicon carbide) ◇ Removal of foreign substances (organic and inorganic) and metal ions ◇ Flexible response to changes in cleaning items and device configuration *For more details, please contact us or download the catalog to view.

  • Other semiconductor manufacturing equipment

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Scrubber cleaning device

Scrub cleaning device

For stubborn stains after grinding, you can choose PVA sponges or nylon brushes for the brush. Since everything is custom-made, we can offer products that incorporate the customer's ideas.

  • Other cleaning machines
  • Other semiconductor manufacturing equipment

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Scrub Cleaning Device After CMP Processing for Semiconductors

Design and manufacture of equipment that meets your requirements! Scrub cleaning device after CMP processing.

At Valius, we design and manufacture "CMP post-processing scrub cleaning equipment" tailored to your needs. Additionally, we are flexible in accommodating requests beyond just equipment manufacturing. Please feel free to consult with us. 【Features】 ○ Pulse JET cleaning ○ Rinse cleaning ○ High-speed spin drying For more details, please contact us or download the catalog.

  • Other cleaning machines

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Introducing the "Spin Scrub Cleaning Device Series" - High Quality and High Performance!

We will introduce the new model of the automatic scrub cleaning device for mass production, as well as the photo mask cleaning device with a cumulative total of over 200 units in the series.

《1》【W-Spin Scrub Automatic Processing Device】  ◆ This is the latest model of "automatic scrub cleaning device" for mass production.  ◆ It is a model focused on high throughput and high reliability.  ◆ Suitable for "cleaning after CMP or polishing," "incoming cleaning," "final cleaning," etc.!  ◆ It supports a variety of options such as "reverse function," "brush pressure setting function," "CO2 ionizer," and more.  ◆ Customization for various needs is also available. 《2》【Photo Mask Cleaning Device】  ◆ This device corresponds to a series based on mask size.  ◆ It is a long-selling model with over 200 units sold in total.  ◆ It has a rich track record with over 90% market share in domestic masks!  ◆ There are also many units in operation at various device manufacturers.  ◆ There are numerous successful cases for "removing resist that adhered during contact exposure" as well! * Please feel free to download the PDF materials or contact us for more information.

  • Other semiconductor manufacturing equipment

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Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc., 2 to 6 inches)

A scrub cleaning device that allows for transportation and drying without touching the front and back of the workpiece! In addition to simultaneous cleaning of the front, back, and sides with a unique mechanism, it also supports combinations with ultrasonic showers and more.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It enables transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Supports transparent wafers as well *For more details, please contact us or download the catalog to view.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

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LT・SiC and other 2 to 6-inch small diameter wafer double-sided simultaneous chemical scrub cleaning device

A chemical cleaning device that enables transportation and drying without touching the front and back of the workpiece, as well as the removal of foreign substances and metal contamination! It also supports a combination with brush cleaning using the chemical solution.

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, followed by chemical spray, megasonic spot shower, and spin drying. It is capable of removing stubborn contaminants and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edge as an option. ■ Simultaneous cleaning of both sides ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameter: φ2” to φ4”, thickness negotiable ■ Supports transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

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Single Chamber Type "Wafer Multi-Purpose Spin Scrub Cleaning Device"

A space-saving cleaning device that removes foreign substances and metal contamination in a single chamber! It accommodates applications from mass production to research and development through a combination of cleaning methods.

A single-wafer device that performs processes from various wafer surfactants, pure water scrub cleaning, chemical spraying, megasonic spot showering, to spin drying all in one chamber. ◇ Space-saving type that completes processes in a single chamber ◇ Compatible with various wafers including Si (silicon), LT (lithium tantalate), and SiC (silicon carbide) ◇ Removal of foreign substances (organic and inorganic) and metal ions ◇ Flexibly accommodates changes in cleaning items and equipment configuration *For more details, please contact us or download the catalog to view.

  • Other semiconductor manufacturing equipment
  • Other cleaning machines
  • Ultrasonic Cleaner

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Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc. 2 to 6 inches)

A scrub cleaning device that allows for transportation and drying without touching the front and back of the workpiece! In addition to simultaneous cleaning of the front, back, and sides with a unique mechanism, it also supports combinations with ultrasonic showers and more.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog to view.

  • Other cleaning machines

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LT・SiC and other 2 to 6-inch small diameter wafer simultaneous chemical scrub cleaning device

A chemical cleaning device that enables the removal of contaminants, metal pollution, and transport and drying without touching the front and back surfaces of the workpiece! It also supports a combination with brush cleaning using chemicals.

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, and can perform chemical spraying, megasonic spot showering, and spin drying. It is capable of removing stubborn contaminants and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edges as an option. ■ Simultaneous cleaning of both sides ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, thickness is negotiable ■ Compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines

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1-chamber type liquid chemical spin scrub cleaning machine

Complete cleaning to spin drying in a single chamber. Space-saving design suitable for research and development as well as small lot production.

The "1-Chamber Type Liquid Spin Scrub Cleaning Machine" is a cleaning machine that allows for various combinations of non-contact cleaning methods such as high-pressure spray, ultrasonic spray, and chemical solutions, as well as contact cleaning methods like brushes. It completes the cleaning process and spin drying within a single chamber, contributing to space-saving design, which reduces installation space and costs. We can propose suitable equipment configurations based on various device configurations, chemical compositions, desired cleaning performance, and budget according to your needs. 【Features】 ■ Various cleaning methods and chemicals can be combined ■ Suitable for research and development applications and small to medium-sized sites ■ Ideal for sites developing and producing new materials such as SiC, GaN, and LT for small-diameter wafers and power semiconductors ■ Compatible wafer sizes: 3 inches to 6 inches (8 to 12 inches can be accommodated upon separate consultation) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Other semiconductor manufacturing equipment

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